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Profile
| Academic position | Full Professor |
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| Research fields | Electronic Semiconductors, Components and Circuits, Integrated Systems, Sensor Technology, Theoretical Electrical Engineering |
| Keywords | integrated circuit processing and technology, nano-device, atomic layer deposition, Copper metallization, Interconnection, Low Dielectric Constant Materials |
Current contact address
| Country | People's Republic of China |
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| City | Shanghai |
| Institution | Fudan University |
| Institute | Department of Microelectronics |
| Homepage | http://me.fudan.edu.cn/faculty/personweb/zhangwei/index.htm |
Host during sponsorship
| Start of initial sponsorship | 01/06/2001 |
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Programme(s)
| 2000 | Humboldt Research Fellowship Programme |
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Publications (partial selection)
| 2002 | Wei Zhang, Peng-Fei Wang, Shi-Jin Ding, Ji-Tao Wang, William Wei Lee: Effect of N2 plasma annealing on properties of fluorine doped silicon dioxide films with low dielectric constant for ultra-large-scale integrated circuits. In: Chinese Physics Letters, 2002, 875-877 |
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